Bambu Lab PLA Basic Accessory Compatibility
| Recommended | Not Recommended | |
| Build Plate | Cool Plate, High Temperature Plate or Textured PEI Plate | Engineering Plate | 
| Hotend | All Size / Material | / | 
| Glue | Bambu Liquid Glue Glue Stick | / | 
| Recommended Printing Settings | |
| Drying Settings (Blast Drying Oven) | 55 °C,8 h | 
| Printing and Keeping Container's Humidity | < 20% RH (Sealed, with Desiccant) | 
| Nozzle Temperature | 190 - 230 °C | 
| Bed Temperature (with Glue) | 35 - 45 °C | 
| Printing Speed | < 300 mm/s | 
| Physical Properties | |
| Density | 1.24 g/cm³ | 
| Vicat Softening Temperature | 57 °C | 
| Heat Deflection Temperature | 57 °C | 
| Melting Temperature | 160 °C | 
| Melt Index | 42.4 ± 3.5 g/10 min | 
| Mechanical Properties | |
| Tensile Strength | 35 ± 4 MPa | 
| Breaking Elongation Rate | 12.2 ± 1.8 % | 
| Bending Modulus | 2750 ± 160 MPa | 
| Bending Strength | 76 ± 5 MPa | 
| Impact Strength | 26.6 ± 2.8 kJ/m² | 
Printing Tips
• For better print results, please reduce the Max volumetric speed from 21 mm³/s to 15 mm³/s when printing PLA Basic Silver/Gold/Bronze.
• Drying conditions: 55℃ for 8 hrs. Store in a dry environment after use. Dry before use if the material absorbs moisture. For more details please refer to: Filament drying instructions on WIKI.
 
                 
                 
                 
                